Valeo and Calyos have signed a Memorandum of Understanding (MoU) to develop and industrialize passive, standalone two-phase chip cooling solutions aimed at data centers and mobility applications.

The companies describe the effort as focused on “high-performance” chip cooling to address rising thermal loads tied to data center hardware and to vehicle electrification and Software Defined Vehicle architectures. The planned systems are passive and two-phase, a combination typically used to move heat via phase change without active pumping at the cold plate level.

For data center engineers, the practical question is where a passive two-phase module lands on the trade curve versus today’s air cooling and pump-driven liquid loops: density, serviceability, and failure modes. “Maintenance-free” and “highly reliable” are attractive claims, but in production they hinge on details like sealing, orientation tolerance, and how heat is ultimately rejected to a facility loop—none of which are covered here.

Valeo also calls the technology an add-on to its existing portfolio of thermal management solutions for data centers and vehicle power electronics.

Source: Valeo