Molex has made a strategic investment in CAEPlus, an early-stage company developing active liquid cooling technology aimed at AI and high-performance computing (HPC) data center heat loads. Molex said the investment is intended to accelerate development of CAEPlus’ BoundaryCool platform, which the company describes as a compact, active cooling architecture targeted at next-generation GPU and ASIC thermal challenges.
Molex characterized the work as part of its data center thermal management efforts, with the goal of advancing BoundaryCool’s active liquid cooling approach for higher heat-removal performance in AI and HPC environments.
CAEPlus’ BoundaryCool platform is described as being engineered for higher heat-transfer performance and larger reductions in CPU, GPU, and TPU chip temperatures than passive cold-plate solutions, while remaining compatible with legacy data center architectures. For operators, that “legacy compatibility” claim is the practical hinge point: the easiest liquid-cooling deployments are the ones that don’t force a full rip-and-replace of rack infrastructure, coolant distribution, or service procedures.
“Advanced thermal management is becoming a critical enabler for the next wave of compute performance,” said Jairo Guerrero, VP and GM, Copper Solutions Business, Molex. “Our strategic investment in CAEPlus reflects Molex’s commitment to supporting innovations in liquid cooling while working with emerging technology leaders to help customers address rapidly evolving AI and compute-intensive data center requirements.”
“CAEPlus was founded to address the rapid pace of change in data center cooling requirements by enabling an entirely new class of active liquid cooling solutions,” said Milad Bashirzadeh, founder and CEO, CAEPlus. “In addition to its investment, Molex brings deep engineering expertise and a strong track record of helping scale innovative technologies.”
Molex said the CAEPlus technology will be added to its thermal management portfolio, expanding the range of offerings aimed at higher-demand computing deployments. Under the agreement, Molex retains exclusive licensing to apply CAEPlus technology to Molex’s portfolio of pluggable I/O solutions. Financial terms were not disclosed.
Source: Molex
