Wolfspeed has introduced its TOLT (TO-Leaded, Top-Side Cooled) package portfolio, a top-side cooled discrete package family built on Wolfspeed’s Gen 4 MOSFET technology. Wolfspeed says TOLT is designed to increase power density and thermal performance in power supplies for data center rack applications, targeting the rising power and cooling requirements in AI and hyperscale data centers.
According to Wolfspeed, the TOLT package is engineered to release heat from the top side of the package to improve cooling efficiency. Wolfspeed says this thermal path enables smaller, more reliable power systems and supports more compact system architectures while sustaining AI data center demand.
“AI is pushing datacenter OEMs to be incredibly strategic about the size and total efficiency of their power systems,” said Guy Moxey, VP of Wolfspeed’s Industrial and Energy business. “Our TOLT product family offers a straightforward path to delivering higher-density, thermally optimized power systems capable of sustaining the demands of AI datacenters, and Wolfspeed’s Gen 4 technology helps these systems run cooler, more efficiently, and more reliably.”
Wolfspeed positions TOLT as the second of three top-side cooled package families, following its previously released U2 portfolio. Wolfspeed also says the TOLT solution is backed by its US-based silicon carbide wafer manufacturing, which it claims supports supply chain resilience and performance consistency at scale for customers.
Wolfspeed reports its 650 V TOLT products are available in a variety of RDSon options via its website. Wolfspeed says it will share more details on the third top-side cooled portfolio in the second-half of 2026.
Source: Wolfspeed
