Yield Engineering Systems (YES) has announced receipt of multiple tool orders from a global AI infrastructure company. These orders, according to YES, cover its portfolio of dry and wet process systems, specifically supporting panel-level manufacturing on glass substrates for next-generation data center and high-performance computing (HPC) packaging.
YES states that its systems will be installed in advanced packaging lines dedicated to hyperscale AI workloads. Applications include training, inference, networking, and co-packaged optics. The company reports that this milestone reflects an industry shift toward glass-based 2.5D and 3D packaging in response to increasing system performance, density, and thermal demands.
The suite of YES equipment ordered for panel-level packaging on glass substrates includes:
- VertaCure: automated vacuum curing systems designed for solvent removal, uniform heating, and particle mitigation
- VertaPrime: low-vacuum vapor deposition systems optimized for adhesion and process readiness
- VeroFlex FAR: precision reflow systems delivering uniform temperature ramping for interconnect formation
- TersOra: edge-zone removal platforms for precise and clean edge definition
- SURE Wet Process Platform: wet etch and cleaning systems tailored for large-panel manufacturing
This order targets advanced packaging requirements in the data center and HPC market. YES also notes that glass substrates are becoming preferred in 2.5D and 3D packaging for their dimensional stability and electrical characteristics. YES claims it supports volume manufacturing transitions from wafer to panel formats, with regional capacity in Singapore.
Source: Yield Engineering Systems
