Day: May 27, 2026

Microchip ships 3.3 kV SiC power modules for solid-state transformers in AI data centers

May 27, 2026

Broadcom samples 50G PON gateway SoC with integrated NPU and Wi‑Fi 8 support

May 27, 2026

Wolfspeed launches 3.3 kV SiC power modules for 2 kV+ DC-link systems

May 27, 2026

Toshiba ships 1200V trench-gate SiC MOSFET samples for AI data centers

May 27, 2026

Get Data Center Engineering News In Your Inbox:

By subscribing, you agree to our Privacy Policy and Terms of Use. You can unsubscribe at any time.

Share Your Data Center Engineering News

Do you have a new product announcement, webinar, whitepaper, or article topic?

Engineering Deep Dives

Why data center power validation is moving to real-time simulation

Voltage surge and transient suppression in data center power systems

Silicon, SiC, or GaN? In the AI rack, the winner depends on where you look

Latest Data Center Engineering News

JEDEC publishes SPHBM4 standard for HBM4-class bandwidth on organic substrates

July 24, 2026

Accelsius two-phase cooling runs NVIDIA B200 9° C cooler than single-phase

July 24, 2026

Ribbon Apollo DWDM and DCI connect JLM data centers Indonesia–Singapore

July 24, 2026

WEKApod 3 targets AI inference with 1.1 EB storage per rack

July 23, 2026

Cornelis CN6000 800G SuperNIC reference design for AMD EPYC and MI400 AI clusters

July 23, 2026

AI UPS deployment to start in 2026 across 5 GW of Crusoe campuses

July 23, 2026

Vertiv to double chiller production capacity for data center cooling by 2026

July 23, 2026

Energy supply deal targets 600 MW powered land data center campus in Texas

July 22, 2026