Wolfspeed has introduced two new 3.3 kV silicon carbide (SiC) power module families in industry-standard footprints, targeting higher-voltage power conversion and distribution needs tied to AI data centers and the broader energy transition. The company is rolling out a high-power half-bridge baseplate module family and a scalable full-bridge baseplate-less module family, both built around a 3.3 kV MOSFET voltage node.
Wolfspeed says the two families are intended to let engineers reduce power stages and move to a 2-level topology for 2 kV and higher DC-link architectures, with a choice between baseplate and baseplate-less mechanical formats. On the baseplate side, the high-power half-bridge module (LM platform) is designed for >800 A applications and aimed at converter topologies used in solar, grid-scale energy storage, and wind-power infrastructure. On the baseplate-less side, the scalable full-bridge module is part of the Wolfspeed WolfPACK family and is designed to support modular architectures, including multi-level, series-stacked, or parallel converter configurations, with the company describing “consistent, matched performance” and optimization for solid-state transformers (SSTs) and modular renewable energy infrastructure.
Packaging and cycling endurance are where these modules are trying to earn their place in always-on infrastructure. Wolfspeed lists sintered die attach in both families, with the WolfPACK module using sintered die attach and an epoxy encapsulant material, while the baseplate module combines sintered die attach with a copper die-top system. Both families use Gen 4 technology with “improved cosmic ray susceptibility,” a reliability consideration that becomes harder to ignore as voltage and uptime expectations rise.
Wolfspeed also ties the new modules to system-level size and loss reductions. For SST applications, the company says the WolfPACK module enables “over 50% footprint reduction” versus traditional equipment through switching performance and system architecture changes. For the high-power baseplate module, Wolfspeed says it delivers up to 42% improvement in switching losses versus other market-available SiC solutions and greater than 90% versus IGBTs, measured at 125°C on a 1.8 kV bus in the same package.
“The release of this 3.3 kV MOSFET voltage node in two complementary footprints was a strategic decision,” said Guy Moxey, vice president of Wolfspeed’s Industrial & Energy business. “We understand the urgency our customers are facing to scale power infrastructure, and these two families enable both established grid-scale players and emerging players with modular architectures to move quickly.”
Samples of the full-bridge Wolfspeed WolfPACK modules IBB020A33GM4 and IBB020A33GM4T, and the HAB900C33LM4 baseplate module, are available for select customers through Wolfspeed direct sales representatives.
Source: Wolfspeed
