LG 600 kW coolant distribution unit earns Nvidia AI Factory validation

LG Electronics has earned NVIDIA AI Factory validation for its 600 kW Coolant Distribution Unit (CDU), clearing a technical verification process intended to standardize cooling performance, reliability, and failover behavior for high-density AI deployments. For data center operators building out liquid cooling at scale, NVIDIA validation can shorten qualification cycles and reduce integration risk when matching cooling infrastructure to specific AI platform requirements.

LG’s 600 kW CDU was evaluated against more than 100 technical criteria. The unit is designed for direct-to-chip (DTC) liquid cooling, delivering coolant to heat-generating components such as GPUs and CPUs, and it’s intended to operate as a “hybrid cooling” approach alongside existing air-cooling infrastructure. LG lists temperature control precision of ±0.25° C for the CDU and includes virtual sensor technology for real-time monitoring and leak detection.

On the controls side, LG pairs the CDU with its Data Center Cooling Control Manager (DCCM) for predictive control and centralized monitoring. The company also says the system supports integration with data center management systems through standard communication protocols.

Validation work for the Chip-to-Chiller chain is performed at LG’s dedicated site in Pyeongtaek, where it tests transient response, temperature changes, and low-load stability across cold plates, the CDU, and the chiller. In practical terms, that end-to-end testing matters because CDU behavior under fast load swings and abnormal conditions (including failover events) is where many liquid loops get messy in real facilities—not in steady-state lab operation.

LG frames the NVIDIA-validated CDU as part of a broader Chip-to-Chiller portfolio that includes chillers, CDUs, and cold plates. The company also plans to pursue NVIDIA certifications for additional large-capacity CDU models, including 1 MW, 2.5 MW, and 4 MW units.

“As AI data centers continue to scale, the need for highly reliable liquid cooling solutions has never been greater,” said James Lee, president of the LG ES Company. “Leveraging our advanced cooling technologies together with the LG Group’s integrated infrastructure capabilities, we are expanding our AI infrastructure business with end-to-end solutions that help enable Physical AI, where AI creates value in real-world environments.”

LG Electronics publishes more detail on its HVAC and data center cooling portfolio, including its chip-to-chiller approach, through its global HVAC business site.