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TI ADC enables nanosecond telemetry to catch AI data center power glitches

Texas Instruments introduced three new analog components aimed at AI data center power monitoring, high-voltage distribution, and timing: the ADC34DSO75 analog-to-digital converter, the LMI800PS isolated hot-swap controller, and the LMK6B bulk acoustic wave (BAW) oscillator.

The headline item is the ADC34DSO75, a 3 GSPS ADC designed for 24/7, low-power, event-based remote monitoring at nanosecond resolution. TI positions it as a way to detect nanosecond-scale power-rail glitches that conventional monitoring can miss, capturing transient fault events in real time using ultra-high-speed sampling plus on-chip digital signal processing. The company also describes it as enabling fully remote, event-based telemetry intended to reduce the need for on-site debugging and oscilloscopes when chasing intermittent power issues.

For high-voltage power delivery, TI rolled out the LMI800PS, an 800 V isolated hot-swap controller meant to collapse a multi-IC discrete approach into a single package while providing in-rush current and power-path protection. The device integrates an isolated bias supply and PMBus telemetry, and TI says that integration can reduce board area by more than 60%. On safety and mechanical layout constraints, the part is specified for 5 kVrms reinforced isolation and more than 8 mm creepage. TI also states it supports both ±400 V and 800 V distributions.

On the clocking side, TI introduced the LMK6B, a BAW-based oscillator targeting timing margin in very high-speed links. TI lists jitter performance of 9.6 fs at 625 MHz and calls out power-supply rejection ratio (PSRR) as a differentiator for maintaining signal integrity as transmission rates increase.

Nanosecond-level telemetry and 800 VDC distribution are both areas where details matter in deployment, not just in a datasheet. Remote, event-based capture of fast transients can be useful only if teams can correlate what the ADC sees with workload changes, PSU behavior, and protection events upstream. And for 800 V architectures, hot-swap, isolation, telemetry, creepage, and fault isolation are the practical pieces that determine whether a bus stays up when something goes wrong in a rack.

“As AI workloads drive massive scale, the need for real-time visibility and architectural stability has never been greater,” said Karthik Vasanth, vice president and general manager for TI’s Data, Converters and Clocks business unit. “By delivering industry-leading solutions for high-speed telemetry, advanced power protection and precision timing, TI is enabling hyperscalers and operators to design the next generation of AI data centers with optimized performance and minimal downtime.”

Source: Texas Instruments

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