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Author: The Data Center Engineer

XPO liquid-cooled pluggable optics MSA targets 12.8 Tbps modules for AI networks

April 27, 2026

MiTAC shows OCP-compliant servers and liquid-cooled AI rack at CloudFest 2026

April 24, 2026

Molex EXTreme PowerEdge Plus card-edge connector delivers 47A per circuit now on Heilind

April 24, 2026

Corning licenses PRIZM TMT ferrules for higher-density AI data center fiber connectivity

April 24, 2026

HyperLight shows 20W 1.6T-DR8 TFLN transceiver with 20% lower power

April 24, 2026

AI server MOSFETs: AOS ships 25V and 80V DFN 3.3×3.3 double-sided cooling parts

April 23, 2026

Tata launches self-healing data center connectivity with 99.99% uptime

April 22, 2026

Magnachip launches 8th-gen 40V/60V MV MOSFETs for server PSUs

April 21, 2026

AI server EMS launches with high heat-dissipation PCB production and rework

April 21, 2026

1.6Tbps DR8 LPO OSFP transceiver uses PIC with integrated lasers and OSPic processor

April 21, 2026
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XPO liquid-cooled pluggable optics MSA targets 12.8 Tbps modules for AI networks

April 27, 2026

MiTAC shows OCP-compliant servers and liquid-cooled AI rack at CloudFest 2026

April 24, 2026

Molex EXTreme PowerEdge Plus card-edge connector delivers 47A per circuit now on Heilind

April 24, 2026

Corning licenses PRIZM TMT ferrules for higher-density AI data center fiber connectivity

April 24, 2026

HyperLight shows 20W 1.6T-DR8 TFLN transceiver with 20% lower power

April 24, 2026

AI server MOSFETs: AOS ships 25V and 80V DFN 3.3×3.3 double-sided cooling parts

April 23, 2026
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  • Home
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