CyberTAN previews 102.4 Tbps liquid-cooled Ethernet switch blueprint at OCP 2026

CyberTAN Technology has detailed a Pallas Series liquid-cooled 1.6T Ethernet switch platform architecture built around Marvell’s Teralynx T100 102.4 Tbps switch silicon, targeting thermal management and power efficiency constraints in high-density AI cluster networks.

The Pallas Series architecture is designed to support the 3 nm Marvell T100 and its 102.4 Tbps capacity. CyberTAN ties that silicon blueprint to a direct-to-chip (D2C) liquid-cooling approach intended to handle more than 1,000 W of localized heat dissipation at the switch. The company also says the design is aimed at delivering an “industry-leading” Power Usage Effectiveness (PUE) profile.

On the optics and coolant side, CyberTAN described a demonstration configuration using a coolant distribution unit (CDU) and multi-point temperature sensing. In that setup, the company says the platform can “safely handle” 40 W OSFP ZR/ZR+ optics with a 45°C liquid inlet temperature, and it claims a PUE of 1.1.

For data center operators, the interesting part isn’t the 102.4 Tbps headline number—it’s the attempt to liquid-cool the switch silicon and keep optics within limits as port density and per-port power climb. If this class of switch can consistently tolerate higher inlet liquid temperatures while supporting 40 W optics, it can widen facility-side options for coolant loop design and reduce reliance on aggressive air-side thermal margins around network rows.

“By designing our Pallas Series around the Marvell T100 silicon specifications, we are empowering global hyperscalers with high-density, low-latency network switch designs that push the boundaries of PUE optimization and thermal control,” said GwongYih Lee, Chairman and CEO at CyberTAN.

Marvell Cloud Switch Business Unit vice president and general manager Rishi Chugh said, “CyberTAN’s Pallas Series platform architecture is a prime example of how the industry can design systems to leverage the massive bandwidth and power-saving capabilities of our 3nm T100 silicon to overcome traditional networking bottlenecks.”

CyberTAN described the OCP Global Summit showing as a “pre-stage development switch platform” prototype, including a chassis schematic, optical housing, and internal cabling, paired with a thermal module intended to simulate T100 silicon workloads.