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Company: OCP Foundation

Cadence launches chiplet ecosystem for data center and HPC designs

January 15, 2026

Leviton launches high-density fiber and immersion cooling solutions for AI and hyperscale data centers

December 5, 2025

Advanced Energy launches 100 kW data center power shelf and high-efficiency converters for AI workloads

November 25, 2025

Xsight Labs and Cyber Forza launch AI-driven cybersecurity for data centers with 800G DPU and SDN switch integration

October 15, 2025

AI cybersecurity and 800G networking platform for data centers announced by Xsight Labs and Cyber Forza

October 15, 2025

Hammerspace and Xsight Labs unveil direct flash-to-network data center architecture for AI workloads

October 14, 2025

Marvell launches active copper cable linear equalizers for data center power-efficient server interconnects

October 14, 2025

Rittal introduces MGX architecture rack for high-density AI data center deployments

October 14, 2025

RocksDB plug-in boosts SSD performance and lifespan for data center RAID

October 9, 2025

Plug-in reduces write amplification in multi-SSD RAID data center environments

October 9, 2025
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Engineering Deep Dives

A closer look at power integrity at AI scale

Testing the weak spots in liquid-cooled server racks: design the connection like it’s the product

Advanced cooling methods for data center power electronics

Latest Data Center Engineering News

Infineon 24 kW SiC BBU reference design runs on 800 V DC bus for AI racks

June 15, 2026

Arista launches 1.6T 7060XE7 switches for rack-scale AI fabrics

June 12, 2026

onsemi launches GaNEXUS GaN power FET portfolio sampling 40V to 650V

June 12, 2026

Wesco to acquire Newark to expand data center cooling services in Southeast Asia

June 12, 2026

vStrata vertical power delivery module targets 50% lower AI power losses

June 12, 2026

Photonic AI network replaces switches, cuts core power 81% in ARIA lab

June 12, 2026

ROHM 750V SiC MOSFET selected for AI server BBU in HVDC systems

June 11, 2026

Navitas launches isolated TO-247-4 package for direct-cooled SiC MOSFETs

June 11, 2026
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