Company: Samsung

Hammerspace sets new IO500 record for HPC-class performance using standard Linux, NFS, and NVMe storage

December 5, 2025

SNIA launches Storage.AI to develop open standards for efficient data infrastructure in AI workloads

August 4, 2025

Get Data Center Engineering News In Your Inbox:

Share Your Data Center Engineering News

Do you have a new product announcement, webinar, whitepaper, or article topic?

Engineering Deep Dives

From air to two-phase liquid: how rack cooling options compare on density and risk

Why your data center needs 135% cooling capacity

Near-packaged optics: rethinking the AI data center interconnect

Latest Data Center Engineering News

MiTAC shows OCP-compliant servers and liquid-cooled AI rack at CloudFest 2026

April 24, 2026

Molex EXTreme PowerEdge Plus card-edge connector delivers 47A per circuit at Heilind

April 24, 2026

Corning licenses PRIZM TMT ferrules for higher-density AI data center fiber connectivity

April 24, 2026

HyperLight shows 20W 1.6T-DR8 TFLN transceiver with 20% lower power

April 24, 2026

AI server MOSFETs: AOS ships 25V and 80V DFN 3.3×3.3 double-sided cooling parts

April 23, 2026

Tata launches self-healing data center connectivity with 99.99% uptime

April 22, 2026

Magnachip launches 8th-gen 40V/60V MV MOSFETs for server PSUs

April 21, 2026

From air to two-phase liquid: how rack cooling options compare on density and risk

April 21, 2026