nVent has announced new modular liquid cooling solutions designed to support current and next-generation data center chips, particularly for artificial intelligence (AI) workloads. The offering includes new row- and rack-based coolant distribution units (CDUs), technology cooling system manifolds, updated racks based on leading reference designs, and a new data center services program. These solutions align with chip manufacturers’ requirements and target the increasing power densities in modern data center environments.

The new nVent portfolio features modular, scalable CDUs for both racks and rows, alongside the next generation of intelligent power distribution units (PDUs) that support both alternating current (AC) and direct current (DC) topologies. All CDU and PDU products use a unified control platform to enhance reliability and improve operational interaction for data center professionals. The technology cooling system manifolds are designed for high-density, compute-intensive applications and modular scalability, addressing the demanding needs of hyperscale operators and colocation providers managing AI infrastructure.

nVent has collaborated with Siemens to develop a joint reference architecture tailored for hyperscale AI workloads, focusing on resilient and globally deployable power and cooling infrastructure. In addition, nVent is participating in Project Deschutes which aims to accelerate liquid cooling adoption across the data center sector.

The company’s updated data center service program covers installation, start-up, preventive maintenance, and spare parts, supporting critical infrastructure where liquid cooling brings high-value IT equipment into proximity with fluids, making reliability and correct maintenance vital.

Source: nVent