TDK has added a new ultra-compact micro point-of-load (POL) power module, the FS3303, targeting space-constrained designs such as optical modules used in AI edge systems. The non-isolated DC-DC module is designed to deliver 3 A in a 2.5 × 2.5 mm footprint with a 1.2 mm height.
TDK rates the FS3303 for 3 A output at ambient temperatures up to 90° C, with operation up to 125° C with derating. Peak efficiency is listed at around 95%. The device supports 2.7 V to 6 V input and provides regulated low-voltage rails from 0.4 V to 3.3 V, aimed at loads including ASICs, SoCs, DSPs, and AI chipsets.
Inside the package, the FS3303 integrates the controller, driver, MOSFETs, and power inductor using TDK’s 3D chip-embedded packaging technology. For board designers, that integration is the main story: a complete POL stage in 1.2 mm of z-height can be the difference between fitting power on-module versus pushing it onto a host board, especially in tightly packed optical and edge-AI form factors where power density and keep-out zones are as limiting as total watts.
TDK also outlined a broader expansion of its micro POL lineup, describing a range that spans 3 A to 80 A outputs across 0.3 V to 3.3 V rails, with height profiles between 1.2 mm and 1.7 mm. The company tied the portfolio to optical module scaling trends, citing compact optical modules moving from 10 Gbit/s to 1.6 Tbit/s, where local low-voltage regulation has to coexist with aggressive mechanical constraints.
For commercialization, TDK said the specific variant FS3303-0400-AL is in full production and is sampling through major distributors.
Source: TDK
