Baya Systems has announced a partnership with Aion Silicon (formerly Sondrel) to deliver a joint solution aimed at speeding definition, design, and deployment of complex system-on-chip (SoC) and chiplet-based systems. The companies say the combined offering is intended to reduce development risk and accelerate time-to-silicon for customers building advanced semiconductor platforms.
The solution combines Baya’s WeaverPro FabricStudio system-architecture exploration platform with its WeaveIP fabric technology, alongside Aion’s system-architecture, integration, and silicon-implementation services. Baya says its software-defined fabric provides a unified data-movement backbone connecting compute, memory, and accelerators, and supports both coherent and non-coherent traffic on a single fabric. Aion says it can translate system requirements into production-ready silicon across single-die and multi-die platforms.
The companies list customer benefits including shorter time-to-silicon; reduced system and integration risk through performance-first design; predictable performance across complex, heterogeneous workloads; scalability from single-die SoCs to chiplet-based systems; and flexibility to adapt to evolving workloads and standards.
The joint solution targets AI, high-performance computing (HPC), and automotive designs, according to the announcement. The companies say it addresses system-level issues such as optimized handling of coherent and non-coherent connectivity across heterogeneous compute elements including CPUs, GPUs, and NPUs; scalable bandwidth with improved power and area efficiency; and deterministic performance under highly complex workloads.
Both companies also said it is expanding its teams to support growing customer demand.
Source: Baya Systems
