Boyd has announced the launch of its Rack Emulator, a new rack-sized thermal testing tool developed in collaboration with NVIDIA. The emulator is designed to automate and streamline validation of direct-to-chip liquid cooling systems for data centers, with a focus on NVIDIA GB200 NVL72 platforms.
The Boyd Rack Emulator simulates both pressure drop and heat dissipation of a server, allowing data center engineers to test coolant distribution units (CDUs) and validate thermal performance before the deployment of actual server hardware. Boyd states the device is programmable and flexible to simulate different server profiles; users can input capacity and pressure drop protocols to automatically operate the emulator as a server analog. The unit also has the capability to test server electrical inputs before installation.
Packaged at rack size, the emulator can be integrated within standard data center server rows, minimizing required space for load bank testing and server simulation. Boyd notes that it requires no specialized training for operation, supporting rapid deployment at scale and simplifying commissioning of liquid cooled racks. The emulator is designed to be easy to ship, store, and handle.
David Huang, Boyd President, Thermal Solutions Division, said, “Advanced AI data centers require innovative thermal technology to support high performance inference and training workloads,” adding, “Developed in collaboration with NVIDIA, Boyd’s programmable Rack Emulator is designed to speed time to deployment for liquid cooled NVIDIA Blackwell infrastructure.”
The Rack Emulator is currently available to order. Boyd also reports that its liquid cooling technologies are available in modular formats and are backed by its global service and manufacturing experience.
Source: Boyd
