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Full-flow AI cooling connectors cut pressure drop up to 90%, CPC says

CPC (Colder Products Company) has launched the Everis DC Series, a family of full-flow connectors aimed at liquid cooling loops used in AI and high-performance computing systems. The new Everis DC fittings target rising thermal design power (TDP) in modern compute platforms, where connector pressure drop and packaging can become real constraints in dense server designs.

The Everis DC in-line connector uses a full-flow design that CPC says delivers up to 90% less pressure drop than valved connectors of the same size. In a liquid-cooled rack, that kind of restriction reduction can translate directly into lower required pump head or more flow margin at the cold plate, which matters when operators are trying to limit pump power and keep CDU capacity focused on heat removal instead of overcoming fittings.

CPC also highlights mechanical integration details that point to tight-space deployments. The Everis DC Series fittings can be integrated directly into cold plates or manifolds, rather than relying on traditional valved connector assemblies, and the company says the lower height profile supports compact 1U tray form factors used in high-density server environments.

The product family includes both in-line and elbow configurations. CPC says the connectors use a swivel design for added flexibility compared with hard-plumbed options. The connectors are manufactured from 304 stainless steel, and CPC says they’re produced in cleanroom environments to support high-purity liquid cooling applications.

“With a growing focus on power consumption, hyperscale customers want solutions that minimize the draw from pumps and coolant distribution units (CDUs),” said Patrick Gerst, general manager of CPC’s thermal business unit. “As a full-flow connector, the Everis DC facilitates more effective coolant flow, helping data center customers improve energy efficiency and reduce operating costs.”

CPC positions the Everis DC connectors as an expansion of its liquid cooling portfolio, alongside its UQD and LQ connector families.

Source: CPC

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