JEDEC, the Solid State Technology Association focused on standards for the microelectronics industry, has announced it is nearing completion of JESD328: LPDDR5/5X Small Outline Compression Attached Memory Module (SOCAMM2) Common Standard. The new JESD328 standard defines a modular, serviceable low-power double data rate 5/5X (LPDDR5/5X) memory module specifically for data center servers supporting artificial intelligence (AI) applications and accelerated computing.
According to JEDEC, the SOCAMM2 specification targets compact, high-density computing environments, offering a mechanical outline suitable for modern data center chassis and dense board layouts. This standard aims to provide scalability to meet the large module capacities required for AI training and inference workloads. JESD328 is expected to support the full LPDDR5X data rate, including configurations up to 9.6 Gb/s per pin, subject to platform signal integrity.
The modules utilize low-power LPDDR5/5X memory components to reduce overall system energy use and cooling demands, aligning with operational efficiency goals in large-scale data center deployments. The SOCAMM2 standard will also introduce a module-level Serial Presence Detect (SPD) device for identification and telemetry, assisting in system configuration and ensuring reliability standards for enterprise environments.
“JEDEC members are actively shaping the standards that will define next generation modules for use in AI data centers, driving the future of innovation in infrastructure and performance,” said Mian Quddus, Chairman of the JEDEC Board of Directors and the JC-45 Committee for DRAM Modules.
JEDEC states that published standards may undergo revisions or changes during or after the development process. Further updates on SOCAMM2 are expected upon publication.
Source: JEDEC
