Qnity has introduced two new thermal interface materials aimed at thermal management in AI, automotive, and other high-power electronics: the Laird Tflex CR910 liquid gap filler and Laird Tgrease 3000 thermal grease.

The new Laird Tflex CR910 is a two-part, dispensable liquid gap filler. Qnity lists a thermal conductivity of 9.2 W/mK and describes the material as soft and compliant, targeting assemblies with larger or uneven gap tolerances where mechanical stresses can work against long-term thermal contact. For engineers, that combination is a practical signal that CR910 is meant to trade rigidity for conformability, which can matter as power density climbs and mechanical stack-ups get less forgiving.

Laird Tgrease 3000 is a non-silicone thermal grease for higher-temperature use. Qnity says it is certified for operation up to 200 °C and is designed for efficient heat transfer across thin bondlines. The company lists thermal conductivity at 3.2 W/mK and highlights “extremely low” pump-out characteristics, targeting reliability concerns in applications where thermal cycling can migrate grease out of the interface over time.

Qnity also calls out Silicon Carbide (SiC) and Gallium Nitride (GaN) power devices as target use cases for Tgrease 3000, where higher operating temperatures are common and thermal interfaces can become a limiting factor for reliability. The blunt takeaway: even modest TIM conductivity gains can be less important than maintaining contact quality and stability over life, especially as device temperatures and mechanical stress increase.

“As AI, advanced computing and electrification continue to push system performance to new levels, managing heat has become one of the industry’s most important engineering challenges,” said Chuck Xu, President, Interconnect Solutions, Qnity.

Source: Qnity