TDK — leaderboard ()

Rambus announces HBM4E memory controller IP for AI accelerators and GPUs

Rambus has announced its HBM4E Memory Controller IP, which it says is designed to meet rising memory-bandwidth requirements in next-generation AI accelerators and graphics processing units (GPUs). The company positions the controller as an HBM4E interface option with added reliability features for high-bandwidth AI and high-performance computing (HPC) workloads.

Rambus says the HBM4E Controller supports operation up to 16 Gigabits per second (Gbps) per pin, delivering up to 4.1 Terabytes per second (TB/s) of throughput to each memory device. Rambus adds that, for an AI accelerator with eight attached HBM4E devices, the configuration translates to over 32 TB/s of memory bandwidth.

The company says the HBM4E Controller IP can be paired with third-party standard or through-silicon via (TSV) physical layer (PHY) solutions to build a complete HBM4E memory subsystem. Rambus says the subsystem can be implemented in a 2.5D or 3D package as part of an AI system-on-chip (SoC) or a custom base die solution.

The primary applications Rambus cites for the controller include AI accelerators, graphics, and HPC. In addition to listing next-generation AI accelerators and GPUs as target devices, the company frames the product around addressing bandwidth bottlenecks between memory and processing for data-intensive workloads.

Rambus says the HBM4E Controller IP is available for licensing and that early access design customers “can engage” now. Additional product information is available at rambus.com/interface-ip/hbm.

Source: Rambus

Get Data Center Engineering News In Your Inbox:

By subscribing, you agree to our Privacy Policy and Terms of Use. You can unsubscribe at any time.

Popular Posts:

Why data center power validation is moving to real-time simulation
Why data center power validation is moving to real-time simulation
CPC-TRM-Tech-Guide-Liquid-Cooling-Reliability-(1)-4
In liquid cooling reliability, tubing choice creates another layer of protection
Warm-Water-Ready-Accelsius-Whitepaper-3
Accelsius two-phase cooling runs NVIDIA B200 9° C cooler than single-phase
Vertiv-Tognana-Innovation-Lab
Vertiv to double chiller production capacity for data center cooling by 2026
6a4f3014091bd43fb15eee94_6a4f2dee21d1dee3314b8959-1783574215391
Lightpath to build AI-grade fiber for two hyperscale data center campuses
TDK — tower ()

Share Your Data Center Engineering News

Do you have a new product announcement, webinar, whitepaper, or article topic? 

Get Data Center Engineering News In Your Inbox:

By subscribing, you agree to our Privacy Policy and Terms of Use. You can unsubscribe at any time.