Author: The Data Center Engineer

Aeonsemi ships AS22010 10GBASE-T PHY with 40% lower power for AI edge

May 29, 2026

Teradata Factory brings on-prem AI and analytics stack

May 28, 2026

Microchip ships 3.3 kV SiC power modules for solid-state transformers in AI data centers

May 27, 2026

Broadcom samples 50G PON gateway SoC with integrated NPU and Wi‑Fi 8 support

May 27, 2026

Wolfspeed launches 3.3 kV SiC power modules for 2 kV+ DC-link systems

May 27, 2026

Toshiba ships 1200V trench-gate SiC MOSFET samples for AI data centers

May 27, 2026

Supermicro, Krambu and Endor team on liquid-cooled AI data centers with waste heat recovery

May 26, 2026

Accelsius ships NeuCool IR150 two-phase direct-to-chip rack cooling, 150kW

May 25, 2026

Hybrid optoelectronic AI computing architecture claims no active cooling needed

May 25, 2026

Cadence and TSMC expand certified design flows for N3, N2, A16 and A14 AI silicon

May 25, 2026

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