Phison and Supermicro deliver high-density data center storage for AI servers and hyperscale racks

Phison Electronics has announced a collaboration with Supermicro to showcase a new server storage solution aimed at supporting high-density workloads for data centers. The partnership integrates Phison’s Pascari D205V solid-state drive (SSD)—offering 122.88 TB capacity, Gen5 NVMe performance, and an E3.L form factor—into Supermicro’s Petascale Storage Family.

Phison reports that this solution is designed to improve storage density, thermal efficiency, and scalability for enterprise infrastructure. The E3.L form factor, which is part of the Enterprise and Datacenter Standard Form Factor (EDSFF) family in Phison’s Pascari D-Series, is engineered for high-density, high-performance environments. Phison states that E3.L supports hot-pluggability and front access, offering double the capacity per slot compared to E3.S, as well as improved airflow and thermal management. These features aim to optimize deployments for artificial intelligence (AI) training clusters, hyperscale environments, and dense edge applications where cooling and space are significant constraints.

The companies target use cases such as AI and machine learning workloads, real-time analytics, and cloud-scale storage, where managing both storage performance and scalability is increasingly important. Phison claims that this integration allows Supermicro Petascale Storage users to reduce total rack space required, lower operational costs, and simplify infrastructure at scale, for both edge locations and core data centers.

“This innovative collaboration with Supermicro sets a precedent to keep pace with the increasing storage demands of tomorrow,” said Michael Wu, GM and President at Phison US. “Customers can expect their storage solutions to have built-in scalability and cost optimizing features from the drive to the rack architecture.”

Source: Phison Electronics