Semtech has announced two new FiberEdge transimpedance amplifiers (TIAs), the GN1834D and GN1818, designed to address power efficiency challenges in scaling artificial intelligence (AI) infrastructure for data centers. The GN1834D targets the emerging 1.6 terabit (T) optical interconnect market with advanced 200 gigabit (G) per channel performance, while the GN1818 delivers up to 20 percent power savings for current generation 800G optical modules.
According to Semtech, the GN1834D is part of its 200G TIA portfolio and supports 8x200G optical modules aimed at 1.6T applications. It incorporates 2.5D mounting technology, utilizing flip chip for the photodetector-to-TIA interface and wire bond for outputs, minimizing parasitic effects and improving signal integrity for next-generation AI cluster connectivity. The GN1834D features a 750 µm pitch linear design to support module versatility.
The GN1818 is designed for 100G per channel applications in 800G infrastructure, providing up to 20 percent power reduction compared to alternatives. Key technical features include a compact 250 µm pitch for high port density and continued low-latency, high-integrity signal performance required for AI workloads. Semtech states that this allows data center operators to extend the value and efficiency of their existing 800G deployments as they prepare for future 1.6T architectures.
Semtech reports that its TIA portfolio for data center optical modules includes the GN1834D, GN1832 (flip chip, 500 µm pitch), GN1834 (flip chip, 750 µm pitch), and GN1836 (250 µm pitch). This breadth is intended to enable module manufacturers to standardize on a single trusted supplier while tailoring solutions to diverse connectivity needs.
Both the GN1834D and GN1818 are available for sampling. Semtech will showcase these and other optical solutions at CIOE 2025 in Shenzhen, China.
Source: Semtech
