Tark Thermal Solutions launches micro thermoelectric coolers for efficient data center server cooling and power savings

Tark Thermal Solutions has introduced new custom options for its OptoTEC MBX Series of micro thermoelectric coolers (TECs), designed to address thermal management challenges in ultra-high-speed optical transceivers used in advanced AI data centers and telecom infrastructure. The company says the MBX Series targets the need for precision temperature control in increasingly compact transceiver modules as bandwidth demands scale from 800 gigabits per second (Gbps) to 1.6 terabits per second (Tbps) and anticipated future 3.2 Tbps links.

According to Tark Thermal Solutions, high-speed optical pluggables in hyperscale and AI data center deployments generate significant heat in minimal space, requiring efficient thermal solutions to stabilize laser diode temperatures, mitigate crosstalk, and maintain signal integrity. The OptoTEC MBX Series achieves tight temperature regulation while fitting within the constraints of OSFP and QSFP module formats, with standard footprints starting at 1.5 mm by 1.1 mm and thicknesses down to 0.65 mm. The coolers deliver heat pumping densities up to 43 W/cm² at reduced operating current compared to conventional TECs, contributing to lower power draw in dense rack environments. High-precision manufacturing and new thermoelectric materials enable rapid thermal response, supporting fast control loops for modulated heat loads typical of next-generation optical links.

Tark Thermal Solutions states that the MBX Series is well suited for pluggable formats such as 800G and 1.6T OSFP/QSFP-DD modules and emerging 3.2T coherent optics, supporting demanding applications in AI cluster interconnects and long-haul dense wavelength division multiplexing (DWDM) systems. The modules provide active stabilization for laser diodes and other heat-sensitive components, maintaining wavelength stability and minimizing signal degradation at high data rates.

“Engineered for thin profiles, high heat packing densities and scalability, MBX coolers position AI data centers and telecom providers to meet tomorrow’s bandwidth demands with confidence,” said Andrew Dereka, Thermoelectrics Product Director, Tark Thermal Solutions.

More technical details are available at the company’s website.

Source: Tark Thermal Solutions

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