Legrand expands data center power and liquid-cooling portfolio with Kratos acquisition and Accelsius investment

Legrand has announced two moves aimed at AI-driven, high-density data center builds: it has acquired Kratos Industries, a manufacturer of low-voltage (LV) and medium-voltage (MV) power equipment, and it has participated in the Series B funding round for Accelsius to support two-phase, direct-to-chip liquid cooling. Legrand says the combination broadens its coverage of power distribution and thermal management for data center infrastructure.

Legrand reports that Kratos, based in Arvada, Colorado, manufactures low-voltage switchboards, medium-voltage switchgear, and integrated power systems for data center gray-space and industrial applications. Legrand also notes Kratos’ vertically integrated production model and engineered-to-order approach, positioning it for “mission-critical deployments.”

Legrand says the acquisition expands its data center gray-space power portfolio, adding to existing offerings that include cable bus, load banks, and cable tray. It also says the Kratos portfolio complements its white-space power products, including busway, busduct, and rack power (PDU) solutions.

Separately, Legrand says its Accelsius investment and partnership expands its data center thermal management scope into direct-to-chip two-phase liquid cooling, with joint development work planned in the white space. Legrand says the companies will collaborate on integrating liquid cooling into rack infrastructure.

Legrand reports that Accelsius’ two-phase cooling is designed to remove heat at the processor level to support higher compute densities while reducing the energy required for thermal management, and it positions the technology for “gigawatt-class AI factories.” Legrand frames the Kratos acquisition and Accelsius partnership as a combined strategy spanning both gray-space and white-space infrastructure for AI and high-performance computing.

Source: Legrand

Get Data Center Engineering News In Your Inbox:

Popular Posts:

Screenshot
Five AI data centers to reach 1 GW power capacity in 2026, new analysis shows
Near-Packaged-Optics--Rethinking-the-AI-Data-Center-Interconnect
Near-Packaged Optics: Rethinking the AI Data Center Interconnect
30cf-data-center-pr
Carrier launches AquaEdge 30CF chiller to boost data center cooling reliability and uptime
Mosaic-4148-2000x1333_1_1
300mm silicon carbide wafers pitched for AI data center packaging by 2030
FalconXpr
AI data center networks: Xscape launches 8-wavelength ELSFP laser module

Share Your Data Center Engineering News

Do you have a new product announcement, webinar, whitepaper, or article topic? 

Get Data Center Engineering News In Your Inbox: