Wolfspeed produces first 300mm silicon carbide wafer to boost data center power and cooling efficiency for AI servers

Wolfspeed has announced it has successfully produced a single-crystal 300 mm (12-inch) silicon carbide (SiC) wafer. Wolfspeed says the milestone is intended to establish a path to future volume commercialization of 300 mm SiC, with target applications including AI infrastructure, augmented reality and virtual reality (AR/VR), and advanced power devices.

The company says the work is backed by an intellectual property portfolio of more than 2,300 issued and pending patents worldwide and supported by a vertically integrated supply chain spanning crystal growth through advanced packaging. Wolfspeed frames the move to 300 mm as a manufacturing scalability and performance step for demanding semiconductor applications, including next-generation computing platforms and high-efficiency power devices.

“Producing a 300mm single crystal silicon carbide wafer is a significant technology achievement and the result of years of focused innovation in crystal growth, boule and wafer processing,” said Elif Balkas, CTO. “It positions Wolfspeed to support the industry’s most transformative technologies, especially critical elements of the AI ecosystem, immersive augmented and virtual reality systems, and other advanced power device applications.”

For data center and AI infrastructure, Wolfspeed says rising AI workloads are increasing demand for improved power density, thermal performance, and energy efficiency. The company says its 300 mm SiC technology is intended to enable wafer-scale integration of high-voltage power delivery systems, advanced thermal solutions, and active interconnects, extending performance beyond traditional transistor scaling.

Wolfspeed also says its 300 mm platform will unify high-volume SiC manufacturing for power electronics with high-purity semi-insulating substrates used in optical and radio-frequency (RF) systems, enabling wafer-scale integration across optical, photonic, thermal, and power domains. Beyond AI infrastructure and AR/VR, Wolfspeed says a larger wafer diameter can improve the ability to meet demand cost-effectively for applications including high-voltage grid transmission and next-generation industrial systems.

Source: Wolfspeed

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