Teradyne has introduced three new instruments for its UltraFLEXplus automated test equipment (ATE) platform aimed at semiconductor test flows tied to AI and data center computing devices. The additions—UltraPin5000-EM, UltraPort-PCIe6, and UltraVS64-HP—target a mix of pattern-heavy digital test, PCIe Gen6 high-speed I/O, and high-current power delivery inside the test cell.
For data center operators, this isn’t gear you’ll rack on the floor. But it matters upstream: tighter validation at wafer probe and package test is one of the few practical ways to reduce the chance that marginal silicon turns into intermittent failures once it’s bolted into an expensive accelerator sled.
The UltraPin5000-EM is a new digital instrument built for “pattern-intensive” AI and compute devices. It has “up to 80 times more vector memory than other market offerings,” with pattern loads “up to 10 times faster,” plus a Persistence Mode intended to enable near-instant reloads. Teradyne also lists 5 Gbps data rates for pattern throughput, a timing architecture that supports independent clock frequencies per pin, scan network acceleration that compiles per-core results in real time, and compatibility with UltraPin2200.
For PCIe, the UltraPort-PCIe6 is described as a high-speed I/O protocol ATE solution for PCIe Gen6 interfaces, delivering 64 Gbps (PAM-4) across 32 lanes per instrument. Features called out include per-pin PMU, integrated loopback capability, and a “dedicated server-class compute backend” that scales to 2 TB of high-performance memory to run large test data sets. Teradyne says the instrument supports mission-mode testing and high-speed I/O scan, with the goal of shifting coverage earlier in the flow to improve Known Good Die confidence and reduce waste of high-value HBM and advanced packaging assemblies.
On the power side, UltraVS64-HP is a power supply instrument rated at 1280 amps per instrument, 5120 amps per ganged supply, and “total test cell capacity exceeding 15,000 amps.” Teradyne highlights a 16 V range aimed at emerging integrated voltage regulator (IVR) architectures, integrated multi-point sense, and “superior dynamic load response” to hold conditions stable as high-current activity shifts across large die and multi-die packages. It also includes power profiling and an “Intelligent power interface” intended to bring system-level power management elements into the test cell, with fast hardware-level fault response designed to guard against thermal runaway and associated probe card or socket damage.
“This new suite of instruments expands the capabilities of our UltraFLEXplus platform, offering the industry’s most advanced, future-proof solutions for testing cutting-edge devices,” said Greg Smith, CEO of Teradyne.
Source: Teradyne
