GigaDevice has introduced its GD25NX series, a new generation of high-performance dual-voltage xSPI NOR Flash memory targeted at data centers, system-on-chip (SoC) developers, and other demanding compute environments. Designed with a 1.8 V core and 1.2 V I/O, GD25NX connects directly to 1.2 V SoCs, removing the need for external booster circuits and reducing both system power consumption and bill of materials cost, according to GigaDevice.
The GD25NX series supports an octal SPI interface and operates at a maximum clock frequency of 200 MHz in both single transfer rate and double transfer rate modes, offering bandwidth up to 400 MB/s. Programming and erase operations are accelerated, with a typical page program time of 0.12 ms and sector erase time of 27 ms, representing a 30 percent faster programming speed and 10 percent shorter erase times compared to conventional 1.8 V octal Flash.
To address the reliability needs of modern data center and automotive applications, GD25NX incorporates error correction code (ECC), cyclic redundancy check (CRC) verification, and data strobe (DQS) features. GigaDevice reports that the device meets high-speed system stability requirements and improves data integrity and product lifespan.
With its 1.2 V I/O architecture, GD25NX reduces read power consumption by as much as 50 percent compared to 1.8 V designs. At a 200 MHz operating frequency, read currents are as low as 16 mA in Octal I/O single transfer rate mode and 24 mA in double transfer rate mode. This suits applications requiring high throughput and improved energy efficiency.
The GD25NX series is available in 64 megabit and 128 megabit densities, with packaging options including TFBGA24 8×6 mm (5×5 ball array) and wafer-level chip-scale package (4×6 ball array). The 128 megabit GD25NX128J samples are available for evaluation, while 64 megabit samples are being prepared.
“The GD25NX series sets a new benchmark for combining low voltage with high performance in SPI NOR Flash,” said Ruwei Su, Vice President and General Manager of Flash BU at GigaDevice. “Its design aligns closely with mainstream SoC requirements for low-voltage interfaces, enabling higher integration and lower BOM costs for customers.”
Source: GigaDevice
