NewPhotonics unveils 3.2Tbps DR8 transmitter PIC with OSPic for AI data centers

NewPhotonics has introduced the NPG10240, a 3.2 Tbps DR8 “transmitter-on-chip” photonic integrated circuit (PIC) aimed at AI data center optical connectivity, with integrated lasers, 448 Gbps modulators, and the company’s OSPic optical signal processor.

The NPG10240 is described as a flip-chip, octal-channel transmitter that combines laser sources, high-speed modulators, and programmable optical equalization in a single engine targeted at 3.2 Tbps DR8 connectivity for hyperscale deployments. NewPhotonics says the device is optimized for both pluggable transceivers and high-density near-package optics (NPO) architectures, and that its design supports 400G-per-lane connectivity.

A key element is the integrated OSPic optical signal processor, which NewPhotonics describes as performing signal equalization in the optical domain. The company says that by addressing electrical impairments optically, OSPic can relax RF design constraints, improve signal integrity, and deliver more consistent link performance at 448 Gbps per lane.

NewPhotonics also highlights heterogeneous laser integration as a way to reduce optical coupling losses, cut down on external components, and improve system power efficiency. For OEMs, the company points to flip-chip packaging as a manufacturing and reliability lever, citing simplified assembly, improved yield, and better long-term transceiver reliability.

Getting to 448 Gbps-per-lane optics is hard because the system-level penalties aren’t just about raw bandwidth; RF channel behavior, packaging, and signal conditioning often decide whether a design is buildable at scale. If NewPhotonics’ approach genuinely reduces the electrical burden by moving more conditioning into the optical domain, that could translate into simpler front-end design and fewer tradeoffs when packing optics closer to the switch or accelerator complex.

“AI clusters are rapidly driving the transition to higher-speed optical interconnects, with the industry moving from 800G and 1.6T to 3.2T in the next phase of scaling,” said Vlad Kozlov, Founder, LightCounting. “Highly integrated photonic engines that combine lasers, modulators and advanced signal conditioning will play an important role in enabling these higher data rates while maintaining power efficiency and manufacturing scalability.”

NewPhotonics said a sampling program for its 3.2T transmitter-on-chip solutions will be available in Q4 2026.

NewPhotonics did not disclose pricing.